Accéder directement au contenu Accéder directement à la navigation
Article dans une revue

Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

Abstract : This paper presents a study of the interface between Cu and a glass fibre reinforced PAMXD 6 polymer. Substrate surface chemistry was characterised before metallisation by spectroscopic techniques including Fourier transform infrared and X-ray photoelectron spectroscopy (XPS). Chemical bonding of Cu layers (20 nm to 2 μn thick) to the polymer was investigated by XPS (depth profiling, argon ion bombardment) and secondary ion mass spectrometry. The results showed that Cu reacts with the polymer, leading to the formation of a Cu-O- C like interfacial compound, and illustrated the influence of the evaporation pressure and temperature parameters on the interfacial structure and final quality of the film. The adhesion strength of the coating, obtained by z axis tensile tests (studs bonded to the PAMXD 6 with an epoxy glue), confirmed the interpretation of the analyses.
Type de document :
Article dans une revue
Liste complète des métadonnées

https://hal-mines-paristech.archives-ouvertes.fr/hal-00674005
Contributeur : Magalie Prudon <>
Soumis le : vendredi 24 février 2012 - 16:29:01
Dernière modification le : jeudi 24 septembre 2020 - 17:22:54

Identifiants

  • HAL Id : hal-00674005, version 1

Citation

Y. Legois, Marc Aucouturier, E. Ollivier, Evelyne Darque-Ceretti, P. Macheto. Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites. Surface Engineering, Maney Publishing, 1998, 14 (3), pp.Pages 259-264. ⟨hal-00674005⟩

Partager

Métriques

Consultations de la notice

256