, References

M. A. Green, J. A. Zhao, A. Wang, and S. R. Wenham, Very high efficiency silicon solar cells-science and technology, IEEE Transactions on Electron Devices, vol.46, issue.10, pp.1940-1947, 1999.
DOI : 10.1109/16.791982

P. Hirsch and S. Roberts, The brittle-ductile transition in silicon, pp.55-80, 1991.
URL : https://hal.archives-ouvertes.fr/hal-00513679

. Fr, J. Dross, B. Robbelein, E. Vandevelde, I. Van-kerschaver et al.,

. Poortmans, Stress-induced large-area lift-off of crystalline Si films, Applied Physics A, vol.89, issue.1, pp.149-152, 2007.

. Fr, A. Dross, J. Milhe, I. Robbelein, P. Gordon et al., Stress-Induced Lift-Off Method for kerf-loss-free wafering of ultra-thin crystalline Si wafers, Photovoltaic Specialists Conference, pp.11-16, 2008.

I. Gordon, F. Dross, V. Depauw, A. Masolin, Y. Qiu et al., Three novel ways of making thin-film crystalline-silicon layers on glass for solar cell applications, Solar Energy Materials and Solar Cells, vol.95, issue.1, pp.52-57, 2011.
DOI : 10.1016/j.solmat.2010.11.031

S. W. Bedell, D. Shahrjerdi, B. Hekmatshoartabari, K. Fogel, P. Lauro et al.,

. Sadana, Kerf-less removal of Si, Ge and III-Vs layers by controlled spalling to enable lowcost PV technologies, IEEE J. Photovoltaic, vol.2, issue.2, pp.141-147, 2012.

S. W. Bedell, K. E. Fogel, P. A. Lauro, D. Sadana, and D. Shahrjedi, Spalling for a semiconductore substrate, Appl. N°, vol.12713560, 2010.

M. D. Thouless, A. G. Evans, M. F. Ashby, and J. W. Hutchinson, The edge cracking and spalling of brittle plates, Acta Metallurgica, vol.35, issue.6, pp.1333-1341, 1987.
DOI : 10.1016/0001-6160(87)90015-0

M. D. Drory, M. Thouless, and A. Evans, On the decohesion of residually stressed thin films, Acta Metallurgica, vol.36, issue.8, pp.2019-2028, 1988.
DOI : 10.1016/0001-6160(88)90303-3

Z. Suo and J. W. Hutchinson, Steady-state cracking in brittle substrates beneath adherent films, International Journal of Solids and Structures, vol.25, issue.11, pp.1337-1353, 1989.
DOI : 10.1016/0020-7683(89)90096-6

Y. Xu and J. A. Blume, Crack interaction and propagation-stability in a thin film/substrate system, International Journal of Solids and Structures, vol.30, issue.19, pp.2587-2596, 1993.

B. Cotterell and J. Rice, Slightly curved or kinked cracks, International Journal of Fracture, vol.2, issue.2, pp.155-169, 1980.
DOI : 10.1007/BF00012619

J. Dundurs, Elastic interaction of dislocation with inhomogeneities, Mathematical Theory of Dislocations ASME, pp.70-115, 1969.

A. Masolin, P. Bouchard, R. Martini, and M. Bernacki, Thermo-mechanical and fracture properties in single-crystal silicon, Journal of Materials Science, vol.260, issue.6
DOI : 10.1016/S0375-9601(99)00571-X
URL : https://hal.archives-ouvertes.fr/hal-00720597

V. Consonni, G. Feuillet, and P. Gergaud, The flow stress in polycrystalline films: Dimensional constraints and strengthening effects, Acta Materialia, vol.56, issue.20, pp.6087-6096, 2008.
DOI : 10.1016/j.actamat.2008.08.019

G. Harlin and J. R. Willis, The Influence of Crack Size on the Ductile-Brittle Transition, Proc. R. Soc. Lond. A, pp.415-197, 1988.
DOI : 10.1098/rspa.1988.0010

D. E. Hauf, D. M. Parks, and H. Lee, A modified effective crack-length formulation in elastic-plastic fracture mechanics, Mechanics of Materials, vol.20, issue.4, pp.273-289, 1995.
DOI : 10.1016/0167-6636(94)00058-1

Y. Y. Wang, A two-parameter characterization of elastic-plastic crack tip fields and application to cleavage fracture, 1991.

H. Gao and C. Chiu, Slightly curved or kinked cracks in anisotropic elastic solids, International Journal of Solids and Structures, vol.29, issue.8, pp.947-972, 1992.

R. D. Deegan, S. Chheda, L. Patel, M. Marder, H. L. Swinney et al., Wavy and rough cracks in silicon, Physical Review E, vol.42, issue.6, p.66209, 2003.
DOI : 10.1063/1.1660699

T. Cramer, A. Wanner, and P. Gumbsch, Energy Dissipation and Path Instabilities in Dynamic Fracture of Silicon Single Crystals, Physical Review Letters, vol.21, issue.18, pp.788-791, 2000.
DOI : 10.1007/BF01114295

D. Sherman and . Be, From crack deflection to lattice vibrations???macro to atomistic examination of dynamic cleavage fracture, Journal of the Mechanics and Physics of Solids, vol.52, issue.8, pp.1743-1761, 2004.
DOI : 10.1016/j.jmps.2004.02.004

D. Sherman, Macroscopic and microscopic examination of the relationship between crack velocity and path and Rayleigh surface wave speed in single crystal silicon, Journal of the Mechanics and Physics of Solids, vol.53, issue.12, pp.2742-2757, 2005.
DOI : 10.1016/j.jmps.2005.07.001