Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, et al.. First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures.
39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4.
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