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Conference papers
Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology
Abstract : Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin2ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjet-printing technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.
https://hal-mines-paristech.archives-ouvertes.fr/hal-01063661
Contributor : Magalie Prudon Connect in order to contact the contributor
Submitted on : Friday, September 12, 2014 - 4:09:40 PM
Last modification on : Wednesday, November 17, 2021 - 12:28:18 PM
Contributor : Magalie Prudon Connect in order to contact the contributor
Submitted on : Friday, September 12, 2014 - 4:09:40 PM
Last modification on : Wednesday, November 17, 2021 - 12:28:18 PM
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