Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation

Komi Atchou Ewuame (1, 2) , Vincent Fiori (1) , Karim Inal (2) , Pierre-Olivier Bouchard (2) , Sébastien Gallois-Garreignot (1) , Sylvain Lionti (1) , Clément Tavernier (1) , Hervé Jaouen (1)

1 ST-CROLLES - STMicroelectronics [Crolles]
2 CEMEF - Centre de Mise en Forme des Matériaux

This work deals with a methodology to evaluate residual stresses within microelectronic devices by using MOS (Metal Oxide Semiconductor) rosette stress sensors. The stress tensor was evaluated by carrying out electrical measurements on test vehicle: the bridge from electrical to stress values was ensured by the piezoresistive relations and, prior to further in-house calibration, coefficients from literature were employed. For correlation purpose, numerical simulations were performed in order to evaluate stresses induced by TSV (Through Silicon Via). In this paper, the whole framework is described, and stress fields evaluated from in-situ electrical measurements on CMOS65 rosette sensor are compared to simulated ones. Some of the ultimate targets of this work are to develop a validated framework to deeply understand TSV induced thermo-mechanical stresses and to allow design rules definitions for products reliability and transistor performances.

Mots clés: FEM Simulation; TSV; Thermomechanics; Piezoresistive Stress Sensor; Residual Stress

Domaines: Matériaux

Komi Atchou Ewuame, Vincent Fiori, Karim Inal, Pierre-Olivier Bouchard, Sébastien Gallois-Garreignot, et al.. Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation. 9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.975-981, ⟨10.4028/www.scientific.net/AMR.996.975⟩. ⟨hal-01063670⟩