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Article Dans Une Revue Microelectronics Reliability Année : 2015

Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect

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Résumé

A new concept of a thermo-mechanical lateral switch activation is proposed. Embedded in standard aluminium BEOL (Back End Of Line), it is fully integrated in CMOS technology. The simplicity of this low cost one-mask fabrication allows the straightforward scalability of design. Most functional problems have been solved through process, simulation and design: stiction, bending, displacement, and robustness. The present study of a thermo-mechanical MEMS switch focuses on three points. Firstly, the design is modified to increase the apparent area contact and the force applied. Secondly, in order to ensure the reversibility of the movement, a running-in step before operation is implemented. Finally, a new design is proposed, simulated and manufactured to avoid the undesirable activations by spurious homogeneous heating.
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Dates et versions

hal-01180626 , version 1 (27-07-2015)

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Citer

Sebastian Orellana, Brice Arrazat, Pascal Fornara, Christian Rivero, Sylvain Blayac, et al.. Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect. Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩. ⟨hal-01180626⟩
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