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Influence of thermo-mechanical stress on the microstructure of sintered silver joints for microelectronics

Thomas Geoffroy 1 Jean-Christophe Riou 1 Eric Bailly 1 Gilles Tarisse 1 Yves Bienvenu 2
1 Sagem - SAFRAN Gr.
2 MAT - Centre des Matériaux
Abstract : Silver sintering is a promising emerging microelectronic assembly technology. In this paper sintered silver attachment joints of silicon dies have been studied. It has been pointed out that in pressureless process conditions porosity can disappear of some zones of silver sintered attachment joints. The link between densified zones and the thermo-mechanical stress has been demonstrated. Densified zones of silver sintered joints could play a great role in reliability improvement.
Keywords : Assembly Copper Fatigue Silicon Silver Stress Thermomechanical processes
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Conference papers
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https://hal-mines-paristech.archives-ouvertes.fr/hal-01336867
Contributor : Bibliothèque Umr7633 <>
Submitted on : Friday, June 24, 2016 - 9:56:39 AM
Last modification on : Thursday, September 24, 2020 - 6:30:07 PM

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Thomas Geoffroy, Jean-Christophe Riou, Eric Bailly, Gilles Tarisse, Yves Bienvenu. Influence of thermo-mechanical stress on the microstructure of sintered silver joints for microelectronics . 2015 IEEE CPMT Symposium Japan (ICSJ), Nov 2015, Kyoto, Japan. pp.62-65, ⟨10.1109/ICSJ.2015.7357360⟩. ⟨hal-01336867⟩

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