Skip to Main content Skip to Navigation
Journal articles

Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

Hiba Fekiri 1 Vladimir A. Esin 1 Vincent Maurel 1 Alain Köster 1 Yves Bienvenu 1
1 MAT - Centre des Matériaux
Document type :
Journal articles
Complete list of metadatas
https://hal-mines-paristech.archives-ouvertes.fr/hal-01633719
Contributor : Bibliothèque Umr7633 <>
Submitted on : Monday, November 13, 2017 - 12:11:34 PM
Last modification on : Thursday, September 24, 2020 - 6:30:07 PM

Identifiers

Collections

ENSMP | ENSMP_MAT | PARISTECH | CNRS | INSTITUT-TELECOM | PSL

Citation

Hiba Fekiri, Vladimir A. Esin, Vincent Maurel, Alain Köster, Yves Bienvenu. Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration. Materials and Design, Elsevier, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩. ⟨hal-01633719⟩

Export

BibTeX TEI DC DCterms EndNote

Share

Metrics

Record views

779