Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Materials & Design Année : 2018

Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

(1) , (1) , (1) , (1) , (1)
1
Vladimir A. Esin
Vincent Maurel
Alain Köster
Fichier non déposé

Dates et versions

hal-01633719 , version 1 (13-11-2017)

Identifiants

Citer

Hiba Fekiri, Vladimir A. Esin, Vincent Maurel, Alain Köster, Yves Bienvenu. Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration. Materials & Design, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩. ⟨hal-01633719⟩
125 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook Twitter LinkedIn More