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Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

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https://hal-mines-paristech.archives-ouvertes.fr/hal-01633719
Contributor : Bibliothèque Umr7633 <>
Submitted on : Monday, November 13, 2017 - 12:11:34 PM
Last modification on : Thursday, September 24, 2020 - 6:30:07 PM

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Hiba Fekiri, Vladimir A. Esin, Vincent Maurel, Alain Köster, Yves Bienvenu. Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration. Materials and Design, Elsevier, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩. ⟨hal-01633719⟩

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