Skip to Main content Skip to Navigation
Journal articles

Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

Complete list of metadata

https://hal-mines-paristech.archives-ouvertes.fr/hal-01633719
Contributor : Bibliothèque Umr7633 Connect in order to contact the contributor
Submitted on : Monday, November 13, 2017 - 12:11:34 PM
Last modification on : Wednesday, November 17, 2021 - 12:28:25 PM

Identifiers

Citation

Hiba Fekiri, Vladimir A. Esin, Vincent Maurel, Alain Köster, Yves Bienvenu. Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration. Materials and Design, Elsevier, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩. ⟨hal-01633719⟩

Share

Metrics

Les métriques sont temporairement indisponibles