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Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration

Hiba Fekiri 1 Vladimir A. Esin 1 Vincent Maurel 1 Alain Köster 1 Yves Bienvenu 1
1 MAT - Centre des Matériaux
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Submitted on : Monday, November 13, 2017 - 12:11:34 PM
Last modification on : Wednesday, November 17, 2021 - 12:28:25 PM

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Hiba Fekiri, Vladimir A. Esin, Vincent Maurel, Alain Köster, Yves Bienvenu. Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration. Materials and Design, Elsevier, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩. ⟨hal-01633719⟩

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