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Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method

Abstract : A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.
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https://hal-mines-paristech.archives-ouvertes.fr/hal-01803489
Contributor : Stéphanie Brunet Connect in order to contact the contributor
Submitted on : Wednesday, May 30, 2018 - 2:08:47 PM
Last modification on : Tuesday, December 7, 2021 - 2:08:08 PM

Identifiers

  • HAL Id : hal-01803489, version 1

Citation

Sandrine Lhostis, Olga Kokshagina, Yann Beilliard, Vincent Fiori. Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method. United States, Patent n° : US2015200151. 2014. ⟨hal-01803489⟩

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