Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method - Archive ouverte HAL Accéder directement au contenu
Brevet Année : 2014

Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method

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Résumé

A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.
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Dates et versions

hal-01803489 , version 1 (30-05-2018)

Identifiants

  • HAL Id : hal-01803489 , version 1

Citer

Sandrine Lhostis, Olga Kokshagina, Yann Beilliard, Vincent Fiori. Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method. United States, Patent n° : US2015200151. 2014. ⟨hal-01803489⟩
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