Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method

Abstract : A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.
Liste complète des métadonnées

https://hal-mines-paristech.archives-ouvertes.fr/hal-01803489
Contributeur : Stéphanie Brunet <>
Soumis le : mercredi 30 mai 2018 - 14:08:47
Dernière modification le : jeudi 6 juin 2019 - 14:02:28

Identifiants

  • HAL Id : hal-01803489, version 1

Citation

Sandrine Lhostis, Olga Kokshagina, Yann Beilliard, Vincent Fiori. Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method. United States, Patent n° : US2015200151. 2014. ⟨hal-01803489⟩

Partager

Métriques

Consultations de la notice

136