Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method

Sandrine Lhostis (1) , Olga Kokshagina (2) , Yann Beilliard (3) , Vincent Fiori (1)

1 ST-CROLLES - STMicroelectronics [Crolles]
2 CGS i3 - Centre de Gestion Scientifique i3
3 SIMaP - Science et Ingénierie des Matériaux et Procédés

A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.

Domaines: Sciences de l'ingénieur [physics]; Micro et nanotechnologies/Microélectronique; Electronique; Energie électrique

Sandrine Lhostis, Olga Kokshagina, Yann Beilliard, Vincent Fiori. Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method. United States, Patent n° : US2015200151. 2014. ⟨hal-01803489⟩