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Assembly of semiconductor chips/wafers

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https://hal-mines-paristech.archives-ouvertes.fr/hal-01804164
Contributor : Stéphanie Brunet <>
Submitted on : Thursday, May 31, 2018 - 2:23:43 PM
Last modification on : Friday, June 1, 2018 - 1:10:17 AM

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  • HAL Id : hal-01804164, version 1

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Citation

Yacine Felk, Ahmed Chaabouni, Alexis Farcy. Assembly of semiconductor chips/wafers. United States, Patent n° : US2011086468. 2011. ⟨hal-01804164⟩

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