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Conference papers

A multiscale analysis of void closure during hot forming processes

Pierre-Olivier Bouchard 1 Michel Saby 1 Marc Bernacki 1 Émile Roux 1 
1 CEMEF - Centre de Mise en Forme des Matériaux
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Conference papers
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https://hal-mines-paristech.archives-ouvertes.fr/hal-01866505
Contributor : Marc Bernacki Connect in order to contact the contributor
Submitted on : Monday, September 3, 2018 - 1:47:36 PM
Last modification on : Wednesday, January 12, 2022 - 9:08:02 AM

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  • HAL Id : hal-01866505, version 1

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INSTITUT-TELECOM | ENSMP | CNRS | ENSMP_CEMEF | PARISTECH | PSL | ENSMP_DR

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Pierre-Olivier Bouchard, Michel Saby, Marc Bernacki, Émile Roux. A multiscale analysis of void closure during hot forming processes. Forging Industry Association 2012 (FIA 2012), Sep 2012, Cleveland, United States. ⟨hal-01866505⟩

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