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Modeling of void closure mechanisms in multi-stages hot metal forming processes: a multiscale approach

Pierre-Olivier Bouchard 1 Abdelouahed Chbihi 1 Marc Bernacki 1 Daniel Pino Muñoz 1
1 CEMEF - Centre de Mise en Forme des Matériaux
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Conference papers
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https://hal-mines-paristech.archives-ouvertes.fr/hal-02114042
Contributor : Marc Bernacki <>
Submitted on : Monday, April 29, 2019 - 1:16:01 PM
Last modification on : Thursday, September 24, 2020 - 5:22:58 PM

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  • HAL Id : hal-02114042, version 1

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ENSMP | ENSMP_CEMEF | CNRS | PARISTECH | INSTITUT-TELECOM | PSL

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Pierre-Olivier Bouchard, Abdelouahed Chbihi, Marc Bernacki, Daniel Pino Muñoz. Modeling of void closure mechanisms in multi-stages hot metal forming processes: a multiscale approach. NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes, Jun 2019, Portsmouth, United States. ⟨hal-02114042⟩

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