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Poster communications

SIMSODI Project : finite element modelling of diffusion bonding by level-set method applied to interface crossing

Luc Védie 1 Emmanuel Rigal 2 Marc Bernacki 1
1 CEMEF - Centre de Mise en Forme des Matériaux
2 CEA/LITEN/DTNM/LT
Document type :
Poster communications
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https://hal-mines-paristech.archives-ouvertes.fr/hal-02419017
Contributor : Magalie Prudon <>
Submitted on : Thursday, December 19, 2019 - 11:40:19 AM
Last modification on : Thursday, September 24, 2020 - 5:22:58 PM

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  • HAL Id : hal-02419017, version 1

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ENSMP | ENSMP_CEMEF | CEA | CNRS | INSTITUT-TELECOM | PARISTECH | PSL

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Luc Védie, Emmanuel Rigal, Marc Bernacki. SIMSODI Project : finite element modelling of diffusion bonding by level-set method applied to interface crossing. REX&GG 2019 - 7th international conference on recrystallization and grain growth, Aug 2019, Ghent, Belgium. ⟨hal-02419017⟩

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